Welcome to episode 200 (!) of the Mobile Tech Podcast with guests Richard Lai (Engadget) and Brad Molen (TCL) -- brought to you by Audible. In this week's (reunion) show we discuss TCL's 20 series and its phone strategy, and review Samsung's Galaxy S21 and S21 Ultra. We then cover Qualcomm's Snapdragon 870 plus MediaTek's Dimensity 1200 and 1100 5G SoCs, and speculate on rumors and leaks from LG and ASUS. Good times...Episode LinksDonate: https://tnkgrl.com/tnkgrl/- Support the podcast with Audible: http://AudibleTrial.com/MobileTech- Richard Lai: https://twitter.com/richardlai- Brad Molen: https://twitter.com/phonewisdom- TCL 20-series: https://www.engadget.com/tcl-20-5g-tcl-20-se-smartphones-foldable-rollable-ces-2021-160044472.html- Samsung Galaxy S21 Ultra review: https://www.engadget.com/samsung-galaxy-s21-ultra-review-specs-price-cameras-snapdragon-888-160013665.html- Samsung Galaxy S21 review: https://www.engadget.com/samsung-galaxy-s21-review-camera-samples-screen-specs-160033680.html- My Moto One 5G Ace review: https://hothardware.com/reviews/moto-one-5g-ace-review- Vivo X60 Pro+: https://www.gsmarena.com/vivo_x60_pro_unveiled_large_main_sensor_upgraded_gimbal_stabilization_dual_tele_lenses-news-47337.php- Qualcomm Snapdragon 870: https://www.engadget.com/qualcomm-snapdragon-870-143023247.html- Moto / Redmi / OnePlus phones coming w/ SD870: https://www.xda-developers.com/oneplus-9-lite-redmi-k40-flagship-moto-g-snapdragon-870-2/- MediaTek Dimensity 1200 and 1100: https://hothardware.com/news/mediatek-dimensity-1200-1100-soc-5g-android- Realme X9 Pro w/ Dimensity 1200: https://www.gsmarena.com/realme_will_release_one_of_the_first_dimensity_1200powered_phones-news-47292.php- LG leaving phone business rumor: https://www.engadget.com/lg-ceo-kwon-bong-seok-mobile-division-exit-losses-094712722.html- ASUS ROG Phone leak: https://www.xda-developers.com/asus-rog-phone-4-could-launch-soon-with-65w-fast-charging/

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