Semiconductor MetrologySemiconductor packaging has become one of the most dynamic areas of electronics innovation. From system in package (SiP) and chiplet integration to fan out wafer level packaging (FOWLP) and 3D stacked architectures, new designs are demanding extreme precision in assembly and inspection. Deviations in coplanarity, surface contamination, voids in underfill, or tilted dies can jeopardize signal integrity and mechanical reliability. To succeed in this environment, manufacturers need semiconductor metrology and inspection systems that deliver high resolution, high speed, and comprehensive 3D measurement capabilities, capable of analyzing everything from solder bumps to reflective silicon dies.Koh Young America has developed a full suite of semiconductor metrology systems built on True3D measurement technology, designed specifically for advanced packaging. The Meister series, including the Meister S, Meister S+, Meister D, and Meister D+, delivers 3D inspection capabilities for ultra thin solder deposits, miniature components, and reflective dies. ZenStar brings True3D inspection to the wafer level, while Neptune C+ and Zenith extend Koh Young’s reach into fluid measurement and SMT AOI convergence. Together, these systems offer process engineers actionable insight, data driven optimization, and confidence in dimensional accuracy across the semiconductor metrology landscape.IntroductionThe semiconductor industry is undergoing rapid transformation. As the physical limits of transistor scaling approach, heterogeneous integration and advanced packaging have emerged as vital enablers for performance, efficiency, and form factor improvements. But with these new architectures come new inspection challenges. Fine pitch interconnects, reflective die surfaces, panel level formats, and multi die stacking all require precision metrology in semiconductor applications, using systems with extreme accuracy and robust defect detection.Koh Young America has long been recognized as a pioneer in 3D solder paste inspection (SPI) and automated optical inspection (AOI). Leveraging its legacy in SMT metrology, Koh Young now delivers semiconductor grade inspection platforms capable of capturing Z height, shape, planarity, and even transparent flux in full 3D. Using its proprietary Moiré projection and multi angle lighting systems, Koh Young systems offer absolute measurement precision across the entire semiconductor metrology and inspection flow.True3D: Why Volumetric Measurement Matters Traditional 2D inspection methods rely on surface contrast, which often fails in advanced packaging. Reflective materials, transparent fluxes, and fine pitch geometries can evade detection. Koh Young’s True3D architecture projects structured light and captures the resulting fringe patterns to create full volumetric reconstructions of each target. This enables absolute height, tilt, and coplanarity measurements, even on challenging materials and surfaces.True3D also means better process feedback. Instead of subjective or pass or fail results, engineers receive quantifiable metrics they can use to identify drift, fine tune tooling, and prevent latent defects. Whether in pre bond inspection or post reflow analysis, this measurement clarity enables more proactive and predictive manufacturing.

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