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Listen "Episode 21: U.S. Tightens Export Net, Siemens–TSMC 3D IC Push & China’s Trade Counterpunch"
Episode Synopsis
This week in Chips Weekly by Diana :🇺🇸 The U.S. expands its export blacklist with a new “50% rule,” instantly pulling hundreds of China-linked subsidiaries into restrictions.🤝 Siemens & TSMC team up on advanced 3D IC and AI design, reshaping the future of multi-die chips and packaging.🇨🇳 China fires back with anti-dumping probes and fresh import controls aimed at U.S. semiconductor suppliers.🔍 Industry Spotlight: The battle over chiplet standards — why whoever controls the rules for modular chips will control the future of compute.💡 Chip of the Week: TSMC’s SoIC-X 3D packaging platform powering the next generation of AI and HPC.🎧 Listen for a sharp, global view of the chip industry — subscribe and never miss a week.#ChipsWeekly #Semiconductors #TSMC #ExportControls #Siemens #ChinaChips #SoICXSupport the showchipsweekly.net
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