Behind the Alloy: Soldering Materials, Process Control, & Reliability Shantanu Joshi & Greg Starrett

14/10/2025 57 min
Behind the Alloy: Soldering Materials, Process Control, & Reliability Shantanu Joshi & Greg Starrett

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Episode Synopsis

This is the second of four episodes on the subject of soldering materials.In today’s episode, continuing the subject of soldering materials, diving deep into the science, strategy, and subtleties behind one of the most foundational elements of electronic assembly: soldering materials. Joining me are two experts from KOKI Solder—Shantanu Joshi, Head of Customer Solutions and Operational Excellence, and Greg Starrett, General Manager of North American Operations. Together, they bring decades of experience in solder chemistry, process engineering, and real-world reliability. We’ll explore how soldering materials influence long-term performance, how material and process decisions interact, and what assemblers should consider when aiming for high-reliability outcomes.From surface finishes and flux residues to void mitigation and future trends in solder formulation, this episode offers practical insights that go well beyond the datasheet.So whether you’re on the factory floor, in the lab, or managing quality and reliability at scale—this conversation is for you.Shantanu JoshiHead of Customer [email protected] StarrettNational Sales [email protected]

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