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Listen "RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts"
Episode Synopsis
Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
The guests may be reached here:
Tim O'Neill
AIM Solder
[email protected]
www.aimsolder.com
Prakash Gango
StenTech
[email protected]
www.stentech.com
Kalyan Nukala
[email protected]
www.zestron.com
The guests may be reached here:
Tim O'Neill
AIM Solder
[email protected]
www.aimsolder.com
Prakash Gango
StenTech
[email protected]
www.stentech.com
Kalyan Nukala
[email protected]
www.zestron.com
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05/11/2025
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30/10/2025
PCB Chat 146: The Latest EDA Market Results
07/10/2025
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